IDENTIFYING DATA 2020_21
Subject (*) NANOFABRICATION AND NANOPROCESSING Code 20705206
Study programme
Nanoscience, Materials and Processes: Chemical Technology at the Frontier
Cycle 2nd
Descriptors Credits Type Year Period
4.5 Optional AN
Language
Anglès
Department Chemical Engineering
Analytical Chemistry and Organic Chemistry
Physical and Inorganic Chemistry
Coordinator
ANDRADE , FRANCISCO JAVIER
SOLÉ CARTAÑÀ, ROSA MARIA
PUJOL BAIGES, MARIA CINTA
MASONS BOSCH, JAIME
FRAGOSO SIERRA, ALEX
E-mail rosam.sole@urv.cat
mariacinta.pujol@urv.cat
jaume.masons@urv.cat
alex.fragoso@urv.cat
franciscojavier.andrade@urv.cat
Lecturers
SOLÉ CARTAÑÀ, ROSA MARIA
PUJOL BAIGES, MARIA CINTA
MASONS BOSCH, JAIME
FRAGOSO SIERRA, ALEX
ANDRADE , FRANCISCO JAVIER
Web
General description and relevant information The overall objective of the subject is that students acquire basic knowledge of manufacturing processes with a resolution in the nanometer scale. The student will acquire the knowledge about their main areas of use, emphasizing the advantages and disadvantages of each of them. The specific objectives are: 1. To introduce to the student the fabrication, deposition and etching techniques suitable for nanotechnology applications 2. Discuss advantages and drawbacks, limitations and fields of applications of the different techniques presented presented 3. Establish complementarities of the different fabrication and processing techniques 4. Acquire the skills to critically propose the correct use of the techniques in different nanotechnology problems

Competences
Type A Code Competences Specific
 A1.1 A1.1. Successfully studying and learning about the chosen research ambit: evaluating the technical and scientific importance, the technological potential and the viability of the nanoscience, design, preparation, properties, processes, developments, techniques and applications of materials.
Type B Code Competences Transversal
 B1.1 Communicate complex ideas effectively to all sorts of audiences.
 B3.1 Work in multidisciplinary teams and in complex contexts.
 B3.2 Resolve conflicts constructively.
 B4.2 Develop abilities to manage their professional career.
Type C Code Competences Nuclear

Learning outcomes
Type A Code Learning outcomes
 A1.1 A1.1 Can formulate knowledge about the basic principles used in the field of nanofabrication and nanoprocessing, materials and the main techniques used in this area.
A1.1 Select the most appropriate nanofabrication methods to solve specific problems of nanotechnology.
Type B Code Learning outcomes
 B1.1 Can intervene effectively and transmit relevant information.
Prepare and deliver structured presentations, complying with the requirements.
Plan their communication: generate ideas, seek information, select and order information, make schemes, decide on the audience and the aims of the communication, etc.
Draft documents with the appropriate format, content, structure, language accuracy, and register, and can illustrate concepts using the correct conventions: format, headings, footnotes, captions, etc.
Be aware of the strategies that can be used in oral presentations (audiovisual support, eye contact, voice, gesture, timing, etc.).
Use language that is appropriate to the situation.
 B3.1 Take active part and share information, knowledge and experiences.
Make their personal contribution in the time expected and with the resources available.
Accept and comply with the rules of the group.
Take active part in planning the team’s work, distributing tasks and respecting deadlines.
 B3.2 Take into account the points of view of others and give constructive feedback.
Contribute to the positive management of any differences, disagreements and conflicts that arise in the team.
 B4.2 Identify their training needs.
Identify their own academic and professional interests and motivations.
Type C Code Learning outcomes

Contents
Topic Sub-topic
Introduction Introduction and preliminary concepts.
Chapter 1. Thin film deposition and growth.
Introduction. Thin film growth. Surface structure. Stages and processes. Epitaxy.
Deposition techniques. Physical techniques (PVD). Chemical techniques (CVD). PCVD techniques. Thin film characterization. In situ techniques. Ex situ techniques. Growth and Deposition Techniques.


Chapter 2. Optical lithography Concept of optical lithography. Conventional optical lithography. Resist. Instrumentation. Microelectronics as the driving force for miniaturization. Limits of optical lithography. Advanced optical lithography.
Chapter 3. Electron beam lithography. Introduction to electron beam lithography. Optical electron systems: electron-beam lithography (EBL). Solids-electron interactions. Beam exposition: Resists. Proximity effects. Process technology. Applications.
Chapter 4. Focussed ion beam technology. Basics of ion-beam-solid interactions:Interactions of the ions with a target:
-Implantation of the primary ions
-Damage of the structure
-Emission of secondary atoms or ions (sputtering)
-Emission of secondary electrons
-Emission of secondary electrons
-Backscattering
-Deposition of molecules
-Ion channelling
FIB apparatus and Dual-Beam
Examples of FIB in the field of analysis
Examples of applications
Summary
Chapter 5. Non-conventional lithographyc techniques I: Atomic Force Microscopies. Lithographs based on near field microscopy: Introduction to scanning probe microscopy (SPM). Summary of scanning probe lithographic methods. Atomic manipulation (STM). Manipulation of objects and molecules. Indentation / local repository. Local oxidation nanolithography. Local dispensing of liquids and molecules (including Dip pen nanolithography). Nanofabrication in parallel.
Chapter 6. Non-conventional lithographyc techniques II: Embossing, imprinting and soft lithographies. Imprinting and embossing techniques. Thermoplastics: vitrious transition temperature. Hot embossing and NanoImprint Lithography (NIL). Curing of resists using UV light. Replica molding. Soft lithographies.
Chapter 7. Thin film processing. Wet etching. Lift-off process. Plasma assisted etching. Reactive ion etching
Etching techniques. Dry etching. Vapour phase etching. Sputtering ion etching
Chapter 8. Global fabrication processes. Fabrication of complex structures using the techniques described in the previous topics. Proposed alternative and complementary techniques.

Planning
Methodologies  ::  Tests
  Competences (*) Class hours
Hours outside the classroom
(**) Total hours
Introductory activities
1 0 1
Lecture
A1.1
B4.2
25 50 75
Presentations / oral communications
B1.1
4 4 8
Personal attention
3 4.5 7.5
 
Extended-answer tests
A1.1
6 12 18
Practical tests
A1.1
1 2 3
 
(*) On e-learning, hours of virtual attendance of the teacher.
(**) The information in the planning table is for guidance only and does not take into account the heterogeneity of the students.

Methodologies
Methodologies
  Description
Introductory activities Activities to make contact and collect student information. Presentation of the subject.
Lecture Delivery and explanation of the contents of the course.


Presentations / oral communications Oral presentation by students of a particular subject or a (previously written presentation).


Personal attention Time that each lecturer has booked to attend and answer questions to students.

Personalized attention
Description
The professors will be available to clarify doubts. It is recommended to contact by email in advance. Dr. Alex Fragoso (coordinator of the course). Dept. Chemical Engineering, office 318 (edificio ETSEQ), e-mail: alex.fragoso@urv.cat. Dr. Rosa Maria Solé, Dept. Physical and Inorganic Chem., office 216 (Facultat de Química), e-mail: rosam.sole@urv.cat. Dr. Jaume Massons, Dept. Physical and Inorganic Chem., office 225 (Facultat de Química), e-mail jaume.massons@urv.cat. Dr. Maria Cinta Pujol, Dept. Physical and Inorganic Chem., Lab. 213 (Facultat de Química), e-mail mariacinta.pujol@urv.cat Dr. Francisco Javier Andrade, Dept. Analitical and Organic Chem., office 312 (Facultat de Química), e-mail: franciscojavier.andrade@urv.cat.

Assessment
Methodologies Competences Description Weight        
Presentations / oral communications
B1.1
Students will be divided into groups and each group will conduct an oral exposition on the work they have developed during the course. 20%
Practical tests
A1.1
Test about unit 8 (Global fabrication) from a practical point of view. 20%
Extended-answer tests
A1.1
Three partial tests will be made during the course on units 1/2/3, 4/5 and 6/7. Each one will have a weight of 20% of the final grade. 60%
Others  
 
Other comments and second exam session

During testing assessment, mobile phones, tablets and other devices that are not expressly authorized alectrònics for the test must be switched off and out of sight.

In the second call, the mark of presentations and practical test (40%) will be maintained and a written exam of the contents of the subject (60%) will be taken.


Sources of information

Basic M.J. Madou , Fundamentals of microfabrication: the science of miniaturization. , CRC Press , 2002
B. Bushan et al. , Springer Handbook of Nanotechnology , Springer, 2006
J.N. Helbert, Handbook of VLSI Microlithography - Principles, Tools, Technology and Applications. , William Andrew Publishing/Noyes , 2001
H.S. Nalwa (editor) , Encyclopedia of nanoscience and nanotechnology , American Scientific Publishers , 2004
Z. Cui , Micro-Nanofabrication: Technology and Applications , Springer Verlag , 2006
M. Ohring , Materials Science of Thin Films , Academic Press , 2002
J.A. Venables , Introduction to Surface and Thin Film Processes , Cambridge University Press , 2001

Complementary

Journals in the field of Nanotechnology

Applied Physics and Chemical Synthesis

Proceedings of conferences in the field of the subject

Recommendations

Subjects that are recommended to be taken simultaneously
CLEAN ROOM TRAINING/20705207

(*)The teaching guide is the document in which the URV publishes the information about all its courses. It is a public document and cannot be modified. Only in exceptional cases can it be revised by the competent agent or duly revised so that it is in line with current legislation.