| Educational guide Escola Tècnica Superior d`Enginyeria |
english |
| Enginyeria Electrònica (2006) |
 Subjects |
| TECNOLOGIA DE MICROSISTEMES |
| Contents |
| IDENTIFYING DATA | 2008_09 |
| Subject | TECNOLOGIA DE MICROSISTEMES | Code | 175101207 | |||||
| Study programme |
|
Cycle | 2nd | |||||
| Descriptors | Credits | Type | Year | Period | ||||
| 4 | Optional | Only annual |
||||||
| Competences | Learning aims | Contents |
| Planning | Methodologies | Personalized attention |
| Assessment | Sources of information | Recommendations |
| Topic | Sub-topic |
| Presentation | |
| Introduction | Microsystem definition ans structure. Clean room classification. |
| Microelectronics Technology | Monocrystals obtention (wafers) Oxidation processes Doping processes Deposition processes: Physical processes (PVD) and chemical processes(CVD) Photolithographic processes Etching processes: dry etchig and wet etching |
| Hybrid Technology | The screen printing process Available inks. How to prepare a ink the drying process The firing process |
| Micromachining processes | Surface Micromachining Bulk Micromachining |
| LIGA process | Process Definition and Applications Masks Obtention Technological steps Alternative processes |
| Interconnection and packaging | "Wirebonding" Tab-Bonding Flip-Chip Wafer Bonding |
